Wafers

Wafers

Wafer Production Technology

State of the art Crystallisation Technique
Reduced Thickness and Saving of raw material

Τhe right start for high effeciency

Solar Cells Hellas uses state-of-the-art DSS (direct solidification) furnaces, for controlled crystal ingot growth, ensuring large crystal grain sizes.

This technique minimizes the number of grain boundaries in the produced wafers, resulting in higher minority carrier life times and hence efficiency in the subsequently produced cells.

Brick polishing improves the mechanical strength of the wafers, eliminating edge and corner chips.

The wire saws use 140μm thin wires, minimizing kerf losses and allowing fine wafer thickness variation control (TTV).

All process consumables used are from leading world-wide suppliers maintaining both production quality and respect to the environment.

Data sheet: Multicrystalline Solar Wafers

Photo Gallery: Wafer Production Line


Solar Cells Hellas uses state-of-the-art DSS (direct solidification) furnaces, for controlled crystal ingot growth, ensuring large crystal grain sizes. This technique minimizes the number of grain boundaries in the produced wafers, resulting in higher minority carrier life times and hence efficiency in the subsequently produced cells. Brick polishing improves the mechanical strength of the wafers, eliminating edge and corner chips. The wire saws use 140μm thin wires, minimizing kerf losses and allowing fine wafer thickness variation control (TTV). All process consumables used are from leading world-wide suppliers maintaining both production quality and respect to the environment.
Data sheet: Multicrystalline Solar Wafers

Photo Gallery: Wafer Production Line

Solar Cells Hellas Group

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Wafers